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BDN16-3CB/A01 sprzedawcę |
sprzedawcę | Numer części | Producent | Szczegółowy opis | Price | Qty. BuyNow | |
DigiKey | BDN16-3CB/A01 | CTS Corporation | HEATSINK CPU W/ADHESIVE 1.61"SQ RoHS : Compliant |
| 0 | |
Avnet Americas | BDN16-3CB/A01 | CTS Corporation | BND Extruded Heatsink 11 x 11 Matrix Pin Fin 13.5°C/Watt Thermal Resistance Adhesive Mount - Trays (Alt: BDN16-3CB/A01) RoHS : Compliant | 0 | ||
Verical | BDN16-3CB/A01 | CTS Corporation | Heat Sink Passive BGA/PGA/PLCC/QFP Pin Array Adhesive 13.5°C/W Black Anodized RoHS : Compliant |
| 1,450 | |
Mouser Electronics | BDN163CBA01 | CTS Corporation | Heat Sinks IERC Heat Sink 1.61x1.61x0.355 RoHS : Compliant |
| 0 | |
Onlinecomponents.com | BDN16-3CB/A01 | CTS Corporation | Heat Sink - Assorted (BGA - LGA - CPU - ASIC...) - 4.50°C/W @ 400 LFM - 13.50°C/W Natural - Aluminum - Black Anodized - Top Mount. RoHS : Compliant |
| 1,451 | |
Master Electronics | BDN16-3CB/A01 | CTS Corporation | Heat Sink - Assorted (BGA - LGA - CPU - ASIC...) - 4.50°C/W @ 400 LFM - 13.50°C/W Natural - Aluminum - Black Anodized - Top Mount. RoHS : Compliant |
| 1,451 |
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